Pioneering the future of high-reliability electronics through innovation and excellence.

 

Our Mission

At The Occam Group, we are committed to revolutionizing electronics manufacturing through our patented solderless assembly technology. Our mission is to deliver superior reliability, thermal management, and cost efficiency for mission-critical applications.

We believe that the electronics of tomorrow should be built without the weaknesses of yesterday. That’s why we developed the Occam Process—a breakthrough technology that eliminates solder joints entirely, creating stronger, more reliable electronic assemblies.

The Journey

Reverse Order Processing to Solderless Assembly for Electronics (SAFE) to The Occam Process:

Joe Fjelstad introduced Occam to the world in 2007. Through a series of technical articles, interviews, and a conference in San Jose, California, Occam garnered great interest from industry experts and almost unanimous approval as an alternative to the challenges of lead-free solder. As a technologist, Joe shared Occam at conferences, in interviews, and in technical papers to anyone who would listen. Over time, frustrated by the slow uptake of this revolutionary technology, he issued several technology licenses, which yielded few results.

Joe later invited Ray Rasmussen, PCB and assembly industry publisher and entrepreneur, to join Occam. The team’s mandate is to find a suitable partner to bring Occam to market.

 

Leadership Team

Our team brings decades of experience in electronics manufacturing, materials science, and business leadership.

Executive Leadership

• CTO & Founder – Joe Fjelstad
• Technical Team – Denny Fritz
• Technical Team Member – Dana Korf
• Managing Partner – Ray Rasmussen
• Nilesh Naik, Eagle Circuits – Manufacturing Partner

The Founder

Occam inventor Joseph Fjelstad has been active in electronics manufacturing since 1972 in roles including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. patents and numerous foreign ones, and is an internationally recognized expert, inventor, and lecturer in electronics interconnection technology. Fjelstad is also a veteran of several startup companies, including Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now Xperi).

Many of Fjelstad’s innovative devices and reliability-enhancing IC packaging features are found in nearly every electronic device made today. He is also the author, co-author, or editor of several books on interconnection technology, including Flexible Circuit Technology, 4th Edition, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach (the Occam Process). Over the past five decades, he has written hundreds of articles, columns, and commentaries for industry magazines and journals.