Skip to content

Solderless by Design

Components are embedded first, then interconnected through direct metallurgical bonds—creating structurally robust, thermally efficient assemblies without reflow or solder joints.

Connect With Us

How It Works

1. Component Preparation

Standard semiconductor packages, bare die, chiplets, and passives are placed face-down in a temporary alignment structure. Unlike traditional SMT assembly, there is no reflow process and no solder paste.

 

2. Encapsulation & Structural Formation

Components are mechanically stabilized within a dielectric matrix that becomes the structural backbone of the system. This structure provides mechanical integrity without thermal cycling damage.

 

3. Direct Metallurgical Bonding

Advanced metallization techniques form direct copper-to-copper or compatible metallurgical bonds between component terminations and interconnect layers. These bonds outperform solder in:

  • Thermal conductivity
  • Mechanical strength
  • Electrical performance
  • Long-term reliability

 

4. Additive Interconnect Build-Up

Using advanced additive or semi-additive processes (including MSAP compatibility), high-density routing layers are built directly onto the embedded component structure. This enables:

  • Fine-line geometries
  • High-density interconnect
  • 3D integration
  • Chiplet architectures

 

5. Final Substrate Formation

The result is a fully integrated, compact, structurally reinforced electronic assembly that eliminates traditional PCB constraints and weak interconnects.

The Occam Process