Resources
Articles
Access technical documentation and detailed analyses covering reliability, thermal performance, EMI/ESD protection, and design architecture. These papers provide deeper insight for engineers seeking a more comprehensive understanding of the Occam Process®.
Are EMS Providers having a Kodak Moment?
Solder: Is It Really Required for Electronics Assembly?
Process Flow for Occam QFN Test Vehicle
Solder’s Days Should Be Numbered—There Is a Better Way
The Hidden Cost of Soldering: A Value-Engineering Perspective on Non-Value-Added Work
A Coming Disruption: The Convergence of the Occam Process and Printed Electronics
Interviews
Explore conversations with industry leaders and technical experts discussing innovation in electronics manufacturing. These interviews offer insight into the vision, applications, and future direction of solderless assembly technology.
Occam Process: Assembly without Solder
Is the Industry Ready for a Solderless World?
Joe Fjelstad Breaks Down His Occam Process
eBook: “SAFE – Solderless Assembly for Electronics”
For a deeper dive into the Occam Process, Joe Fjelstad has produced an ebook which goes into more detail about the technology and its advantages.
Download a copy of the Occam ebook:Solderless Assembly for Electronics: The SAFE Approach
Frequently Asked Questions
Our FAQ section addresses common questions about the Occam Process®, including performance benefits, implementation options, and partnership models. It’s designed to provide clear, straightforward answers for engineers and decision-makers evaluating advanced manufacturing solutions.